Electrical interconnect integrity measuring method

ABSTRACT

A method of bond quality monitoring wherein a bonding machine is fitted with a touchdown mechanism including a pair of contacts (23, 24), which normally open upon touchdown of a bonding tool (27) raised and lowered by a bond head carriage (13). As the tool (27) is lowered towards a bonding surface (31), the bonding machine&#39;s computer (61) performs a test (103) to sense production of a touchdown signal produced by opening of the contacts (23, 24). If touchdown is sensed, the carriage (13) proceeds to an overtravel position. Upon reaching the overtravel position, a second test (108) is performed to confirm touchdown, and energy is then applied to the bond site. During energy application, the logic state of the touchdown mechanism is checked to ensure that the contacts do not close, for example, to check for application of inadequate force during bonding. If a contact closure is sensed, the bond site location is logged for further examination such as a nondestructive pull test. When the carriage ascends, the distance it travels before closure of the contacts ( 23, 24) is used as a measure of bond deformation and, hence, bond quality.

This is a continuation of application Ser. No. 08/015,271 filed Feb. 5,1993 now U.S. Pat. No. 5,459,672, which was a continuation of Ser. No.07/559,737 filed on Jul. 30, 1990, now abandoned.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The subject invention relates generally to electrical circuitfabrication and, more particularly, to a method and apparatus formeasuring the quality of interconnection made by a bonding machine as itoperates.

2. Description of Related Art

In the prior art, wirebonders are known for establishing wireinterconnection to electrical contacts, for example, between anintegrated circuit (IC) pad and substrate gold. One such commerciallyavailable wirebonder is the Model HMC 2460 thermosonic wirebonderavailable from Hughes Aircraft Company. Such a wirebonder includes anultrasonic transducer, an ultrasonic feedhorn, and a bond tool orcapillary. Mechanical force and ultrasonic energy are applied to thecapillary to create a wirebond between a bond surface and a gold ballhaving a diameter of, e.g., 0.7 to 2.0 mils.

In operation, the wirebonder applies heat to the bond site via a heatedstage located underneath the bond surface. Force is applied by pressingthe capillary down toward the bond surface. An ultrasonic signal isgenerated by the generator and converted to a mechanical ultrasonic.frequency vibration of the feedhorn by the transducer. The capillarytransmits the ultrasonic energy and downward force, effectively"scrubbing" the gold ball against the bond surface. The combination ofheat, force, and ultrasonic vibration causes bonding between the bondsurface and the gold ball.

Wirebonds formed by wirebonding apparatus have typically been requiredto go through laborious and expensive testing. For example, currentmilitary requirements specify internal visual inspection for determiningthe integrity of wirebonds and other microcircuit interconnections.Visual inspection of wirebonds has become a costly task. Productionoperators may review hundreds of thousands of initial build wirebondsand rework build wirebonds in a normal week. Given such facts, theindustry has been moving towards automated methods for testing andverifying the integrity of interconnections such as those made bywirebonders. One such approach has been that referred to as bondsignature analysis, such as the method disclosed in the copending U.S.Application of Owen E. Gibson et al. for a Bond Signature Analyzer,assigned to Hughes Aircraft Company, wherein an electrical signalindicative of bond quality is sampled and analyzed to determine bondquality. While useful, bond signature analysis has the disadvantage ofbeing relatively complex and expensive to implement.

SUMMARY OF THE INVENTION

Accordingly, it is an object of the invention to provide a method ofmeasuring the quality of electrical interconnections;

It is another object of the invention to provide a method of measuringthe quality of interconnections made by a wirebonding apparatus; and

It is another object of the invention to provide such a method which isrelatively simple and less expensive to implement.

According to the invention, the touchdown mechanism of a bond head on abonding machine is used to make a bond integrity measurement. Thetouchdown mechanism is typically used to sense the touching of thebonding tool on its target surface before energy is applied from thebonding tool to the target surface for interconnect (bonding).

The relatively simple touchdown mechanism and its movement dynamicsduring the interconnect (bonding) process allows a method of determininginterconnect integrity. According to one aspect of this method, therelative distance traveled between the bonding tool and its supportingcarriage is measured after bonding; the information gleaned indicatesinterconnect (bond) integrity. The information can be logged by thebonding machine's computer for statistical process control methods, oras a listing of possible weak interconnect locations.

Another aspect of the method provides a measure of the quality of theinterconnection process as the bonding machine operates by detectingwhether the controls close during application of bonding energy. Theinformation can be used to correct the process on a next interconnectlocation basis, to log information for statistical control of theinterconnect process, to alert the user to possible weak interconnect(bonding) sites, and to inform the operator of a malfunctioning bondingmachine. The method can be applied to wire, die, and TAB bondingmachines.

BRIEF DESCRIPTION OF THE DRAWINGS

The preferred embodiment of the present invention, both as to itsorganization and manner of operation, together with further objects andadvantages, may best be understood by reference to the followingdescription, taken in connection with the accompanying drawings, ofwhich:

FIGS. 1-5 are schematic diagrams of bonding apparatus at various stagesof operation and useful in illustrating the preferred embodiment; and

FIG. 6 is a flow chart useful in illustrating the method of thepreferred embodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The following description is provided to enable any person skilled inthe art to make and use the invention and sets forth the best modescontemplated by the inventors of carrying out their invention. Variousmodifications, however, will remain readily apparent to those skilled inthe art, since the generic principles of the present invention have beendefined herein specifically to provide a particularly efficient anduseful bond integrity measurement method.

FIG. 1 illustrates a ball bonder apparatus 11 including a bond headcarriage 13, an ultrasonic transducer 15, a force actuator 17, and arigid touchdown sensor arm 19 fixed to the bond head carriage 13. Theultrasonic transducer 15 includes an integral, vertical member 21mounting a moving touchdown contact 23, which cooperates with a fixedtouchdown contact 25 located on the touchdown sensor arm 19. Theultrasonic transducer 15 further includes a bonding tool 27, whichapplies a wire ball 29 to a target surface 31. The bonding tool 27,typically a capillary, is pivotally linked to the touchdown sensor arm19 to pivot about a point 33 in response to actuation of the piston 35of the force actuator 17 and the overtravel. The bonding tool 27 israised and lowered by vertical up/down movement of the bond headcarriage 13 with respect to its frame (not shown). Movement of the bondhead carriage 13 is controlled by a system computer 61 and monitored bya position encoder 63, which supplies a position feedback signal to thecomputer 61.

Electrically, the moving touchdown contact 23 is grounded, while thefixed touchdown contact 25 connects to a logic circuit 41. Moreparticularly, the contact 25 is connected to a resistance R and to theinput of an amplifier/logic circuit 43.

In operation, before an interconnect (bond) is made, the bond headcarriage 13 carrying the bonding tool 27 descends until the bonding tool27 is near the interconnect target, typically 0.008 inches from thetarget surface 31. The bond head carriage 13 then slows to a fixedsearch velocity and maintains this search velocity until the bondingtool 27 carried by the ultrasonic transducer 15 touches the interconnecttarget: surface 31. Note that the bonding tool 27 may be carrying wire,an integrated circuit die, or a bare noncapillary if the machine is awire bonder, die bonder, or Tape Automated Bonding bonder, respectively.If the machine is a wire bonder, wire may be located at the tip of thebonding tool and may be in the form of a ball or a column (stitch).

At the instant before contact with the interconnect target surface 31,the touchdown mechanism contacts are held closed together and at areference position 36 by the force actuator 17. This reference position36 is shown in FIG. 1. The force applied by actuator 17 is a value whichis programmed as part of the conventional interconnect process. Theinstant after the wire ball 29 and, thus, the bonding tool 27 contactsits target 31, the touchdown mechanism's contacts 23, 25 open; i.e.,they move from their reference position 36, as shown in FIG. 2. Openingof the contacts 25, 27 causes the bonding machine to receive an outputsignal from the logic circuit 43 and to thus sense that the target 31was contacted. The programmed force continues to be applied to thebonding tool 27 and, thus, to the interconnect target 31. The bond headcarriage 13 will continue its downward motion and overtravel the actualtouch position by a programmed distance, although the bonding tool 27 isstopped by the target 31. The overtravel is a programmed distance movedby the bond head carriage 13 toward the interconnect target 31 after thecontacts 23 and 25 have separated. As overtravel occurs, the touchdownmechanism's contacts 23 and 25 move a further distance from theirreference position.

When the programmed overtravel of the bond head carriage 13 is complete,as illustrated in FIG. 3, a programmed amount of energy is applied tothe bonding tool 27. The energy is typically force and mechanicalultrasonic motion, and is programmed by amplitude and time. As theenergy is applied and bonding occurs, the wire 29 and surface 31 deformwhere the bonding tool 27 is contacting. The force acting on the bondingtool 27 during the deformation pushes the bonding tool 27 down andcloser to the interconnect surface 31, causing the touchdown mechanismcontacts 23, 25 to move back towards their reference position 36 as thebonding tool 27 moves down.

If the moving contact 23 moves all the way back to the reference point36 shown in FIG. 1 during bonding, there is a good indication thatmechanical force, one of the three important parameters of bonding, wasnot applied during the entire process time. The bonding machine canreact in at least two ways to such an indication: (1) it can log theoccurrence of incomplete force at that interconnect site, or (2) it canmonitor the touchdown mechanism's contacts 23, 25 during the processtime, and if the reference point 36 (contact closure) is sensed, thebonding machine's computer 61 can command the bond head carriage 13 toovertravel an additional distance. This second alternative ensures thatforce is applied during the entire process time.

Moreover, after the interconnect bonding process is complete, the bondhead carriage 13 and the bonding tool 27 ascend away from theinterconnect target 31. The distance the bond head carriage 13 must moveduring this ascent until the bonding tool 27 lifts off the target 31 andcauses the touchdown mechanism's contacts 23, 25 to return to theirreference position 36 can be measured, and that distance can be used asa measure of deformation of the interconnect site. The deformationinformation may also be used as an indication of bond quality.

Moreover, the touchdown mechanism's contacts 23, 25 are used to preventagainst a false indication of contact with the target surface. Such afalse indication is often caused by bonder machine disturbances: damagedwire; bearing friction spots; damaged, worn, or clogged bonding tool;etc. The instant after the (false) contact is sensed, the bondingmachine is programmed to delay a period of about the mechanical timeconstant of the touchdown mechanism. After the selected delay, thebonding machine checks the touchdown mechanism's contacts 23, 25 again;if they are at their reference position 36, the bonding machinere-commands a search velocity until the touchdown mechanism sensestouchdown; again, the touchdown contacts 23, 25 are checked againstfalse contact, ad infinitum.

In the preferred embodiment of the foregoing method, the touchdownmechanism contacts 23, 25 are used to recover against false touchdownand to ensure that force was applied to the interconnect site during theentire programmed process time. If force was not applied during theentire process time, the occurrence is logged in the memory of thecontrolling computer. The number of occurrences of false touchdown andcorrupted force is accessible to the operator of the bonding machinethrough a keyboard memory access operation and may be used in processrefinement, or as an indication of bonder machine performance. Thepreferred method may be used with commercially available apparatus suchas the Hughes Model 2460-III automatic ball, Model 2470-III automaticwedge, and Model 2900A automatic TAB bonders.

The preferred method and apparatus will now be described in asequential, step-by-step fashion in connection with FIGS. 1-5 and theflow chart of FIG. 6.

Sequence:

FIG. 1: The bond head carriage 13 with bonding tool 27 and wire 29 arelowered under computer control toward the interconnect target site 31,step 101 of FIG. 6. During this downward travel, the touchdown mechanismcontacts 23, 25 are closed, which puts the logic electronics 41 in logicstate 0. The programmed force is delivered from the force actuator 17and acts to hold the contacts 23, 25 together. While the tool islowering, the system software performs a test for touchdown, test 103 inFIG. 6. As long as touchdown is not sensed, path 104 is followed and thetool 27 continues to lower.

FIG. 2: The instant after the wire 29 and bonding tool 27 contacts thetarget 31 the bonding tool's motion is stopped, and the touchdownmechanism's contacts 23, 25 separate via the pivoting of the ultrasonictransducer 15 relative to the bond head carriage 13. The logicelectronics 41 are changed to state 1, which is detected as touchdown bythe system software test 103. Force is now being delivered to the targetsite 31. The bond head carriage 13 is still traveling down to itsprogrammed overtravel distance. During the downward travel, the systemperforms a test 105 to determine whether the overtravel position hasbeen reached. Overtravel is detected by computer 61 when the bond headcarriage 13 has traveled a selected (programmed) distance after touchwas sensed.

FIG. 3: At the overtravel distance, the bond head 13 stops its downwardtravel. The force is still being delivered to the target site 31. Allmotion is stopped. The touchdown sensor is rechecked for false sense oftouchdown (see FIG. 6). Test 105 is now satisfied and test 108 isperformed to recheck the touch signal output by amplifier 43. This testensures that touchdown was not falsely sensed during test 103, forexample, as a result of system aberrations such as a clogged capillarytool, mechanical wear, or worn contacts. If touchdown is not confirmedby test 108, the tool restarts its downward travel and the flow proceedsback to the beginning, test 101.

FIG. 4: When the overtravel position is reached and the bond head 13 isstopped and there is a valid touch sense, test 108 is satisfied andbonding energy is applied to the bonding tool 27, as indicated by step107 of FIG. 6. This application of bonding energy causes the wire 29 todeform. As wire deformation occurs, the bonding tool 27 moves downwardand its pivoting about point 33 causes the touchdown contacts 23, 25 tomove closer together.

In a good bonding process, at the end of process time tested for in step109, the touchdown mechanism's contacts 23, 25 should not be touching.If they are not, the bond head carriage 13 will ascend, step 115. Thebonding machine's computer measures the distance that the bond headcarriage 13 ascends, step 115, until the touchdown mechanism's contactstouch. This measurement is preferably achieved by storing the output ofa position encoder at the time of occurrence of an interrupt generatedin response to closure of the contacts 23, 25, i.e., the return to alogic state 0. When the contacts touch, that value is used to computethe wire deformation (TAB deformation, I.C. depth into epoxy, etc.). Thecomputed value is logged into a bond quality data file.

FIG. 5: In a flawed bonding process, the contacts 23, 25 can closeduring the time that energy is applied, for example, causing the forcenot to be applied during the entire bonding process. The logicelectronics 41 then change to state 0, causing test 111 of FIG. 6 to besatisfied. In such case, force will not be delivered to the target 31,but to the touchdown mechanism's contacts 23, 25, and poor interconnectis likely. In response to detection of logic 0 during application ofenergy, the bonding machine may move the bonding head 13 downward tocorrect for the problem, and its computer may log information such asthe location of the interconnect site. A nondestructive pull test orother testing of the logged site may then be performed.

The foregoing method of wire bonding may be extended to die attach, andTAB bonding, and to any interconnect process which uses a similarmechanism. With respect to die attach bonding, IC dies are placed intoepoxy at the target site. They are then pushed down into the epoxy toensure the IC dies have a good epoxy bond with the substrate. The depthto which they are pushed is important for thermal, wire, and TABattachment requirements, and can be monitored by procedures analogous tothose described above. The TAB bonding process is similar to the wirebonding process, except that the bonding tool is a bare capillary: thewire for interconnect is already placed at the interconnect site.

Those skilled in the art will appreciate that various adaptations andmodifications of the just-described preferred embodiment can beconfigured without departing from the scope and spirit of the invention.Therefore, it is to be understood that, within the scope of the appendedclaims, the invention may be practiced other than as specificallydescribed herein.

What is claimed is:
 1. A method of bond quality determination in asystem wherein a bonding tool attached to a bond head carriage descendsand ascends toward and away from a touchdown position at which a bond isformed, comprising the steps of:providing a means for sensing when saidtool reaches said touchdown position and for producing a touchdownsignal having a first state indicating that said touchdown position hasbeen reached and a second state, said second state occurring as saidbonding tool ascends away from said touchdown position, and wherein saidmeans for sensing when said tool reaches said touchdown position ismechanically coupled to said tool; testing for occurrence of saidtouchdown signal; forming said bond in response to detection of saidtouchdown signal; causing said carriage to ascend away from the formedbond; and computing the distance said carriage ascends prior to a changein state of said touchdown signal to said second state, said distancecomprising a measure of bond quality.
 2. A method of bond qualitydetection in a system wherein a bonding tool descends and ascends towardand from a touchdown position at which a bond is formed, comprising thesteps of:providing a means for sensing said touchdown position and forproducing a touchdown signal having a first state indicative thereof anda second state, and wherein said means for sensing is mechanicallycoupled to said tool; testing for occurrence of said touchdown signal;forming said bond in response to detection of said touchdown signal;causing said bonding tool to ascend away from the formed bond; andcomputing a distance said bonding tool ascends prior to a change instate of said touchdown signal.
 3. The method of claim 2 wherein saiddistance comprises a measure of bond deformation.
 4. A method of bondquality detection in a system wherein a bonding tool descends andascends toward and from a touchdown position at which a bond is formed,comprising the steps of:providing a means for sensing when said toolreaches said touchdown position and for producing a touchdown signalhaving a first state indicative thereof and a second state, and whereinsaid means for sensing is mechanically coupled to said tool; testing foroccurrence of said touchdown signal when said tool reaches saidtouchdown position; forming said bond in response to detection of saidtouchdown signal; monitoring the state of said touchdown signal and saidtool during said step of forming said bond; and detecting a change instate of said touchdown signal during formation of said bond to providean indication of poor bond quality, and wherein the absence of detectingthe change in state during formation of said bond is indicative of goodbond quality.
 5. The method of claim 4 further including the step ofstoring an indication of said change of state.
 6. The method of claim 5further including the step of performing a quality test on said bondafter detection of a said change of state.
 7. A method of bond qualitydetection for use with a system wherein a bonding tool and bondingmaterial descends toward and ascends from a bonding site at which a bondis formed, comprising the steps of:providing a means for generating asignal having a first state that is indicative of a reference positionand a second state that is indicative of when said bonding tool andbonding material touches the bonding site; causing the bonding tool andbonding material to descend toward the bonding site; generating thesignal having the second state when said bonding tool and bondingmaterial touches said bonding site; causing said bonding tool to descenda predetermined distance after generation of said signal having thesecond state to apply force to said bonding material and bonding site;applying energy to said bonding tool after said tool has descended thepredetermined distance to form said bond; monitoring the state of saidsignal while energy is applied to said bonding tool during formation ofsaid bond; detecting the occurrence of the first state of said signalduring formation of said bond or upon removal of said tool as it ascendsfrom said bonding site; and processing the first and second states ofsaid signal to provide an indication of the quality of the formed bond,and wherein an indication of good quality of the formed bond is providedif the second state of said signal occurs upon removal of said tool fromsaid bonding site, and an indication of poor quality of the formed bondis provided if the second state of said signal occurs during formationof said bond.